High temperature, lead-free Soldering Fountain used for removal and replacement of through-hole components, connectors, etc. mounted on PC boards.
- Microprocessor based digital controller that regulates solder temperature, wave height, and solder flow duration
- 10 menu storage
- Overhead locator laser light pinpoints position for centering components over the wave
- Height adjustable stainless steel platform
- Large selection of nozzles for all component sizes
- Easy to change bayonet mount nozzles for a variety of rework or selective soldering applications
- High temperature (350°C), compatible with lead-free operation
- Universal X, Y, & Z Board Fixture Option for board sizes up to 11" x 16.5" (280 mm x 420 mm)
Solder Fountains |
Blow-thru Air Nozzle |
N/A |
Board Size |
8.5" to 18" (203 mm to 457 mm) x 16" (406 mm) |
Compressed Air Required |
N/A |
Max Solder Temp |
662°F (350°C) |
Overall Dimensions |
16" x 26" x 17" (406 mm x 660 mm x 432 mm) |
Solder Capacity |
50 lbs (23 kg) |
Solder Type |
Hi-temp lead-free |
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