Re-flow oven utilizing our 100% patented forced air Horizontal Convection™ Heating technology provides for greater thermal uniformity and process control. The GF-12HT is lead free compatible for RoHS compliant soldering and has an option for a computer control interface. The temperature profiling accessory kit includes all the accessories you need to profile PC boards through your re-flow oven. It is compatible with any ovens or profiling systems which use standard K-type thermocouples. With all the options combined with the low benchtop re-flow oven price, it is perfect for lab use or backup prototype production .
With this model there is an option to have a nitrogen re-flow oven with the nitrogen gas inerting feature. With the isolated chamber design (re-circulation of atmosphere within 3 re-flow zones) low oxygen levels are maintained while conserving nitrogen consumption. The advatages are: decreased wetting angle, increased flux efficiency, enhanced fine pitch solder fillets, and improved surface finish of solder joints.
Re-flow Ovens | |
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Conveyor Extensions | Option |
Cooling Station(s) | 1 |
Cooling Zone Venting | N/A |
CyclonicsTM (forced air) | 6 |
Heat Tunnel Length | 26" (660 mm) |
Heating Zones | 3 top, 3 bottom |
Max Board Height | 1.375" (35 mm) |
Max Board Width | 12" (305 mm) |
Max Temperature | 350°C (662°F) |
Nitrogen Option | Yes |
Overall Dimensions | 39" x 32" x 19" (990 mm x 813 mm x 483 mm) |
PC Interface | Option |
Venting | 4" flange, 100 CFM max |