Re-flow hot plate used for a variety of heating applications which include preheat, rework, re-flow and curing of printed circuit board assemblies. The GF-DL-HT is capable of lead and lead free, high temperature applications and has dual programmable, digital temperature controllers for precise temperature regulation.
Re-flow Ovens | |
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Heating Area | 2 13" x 6.5" (330 mm x 163 mm) |
Power | 900W each plate |
Temperature Range (standard model) | 37° to 315°C (100° to 600°F) |