Re-flow hot plate used for a variety of heating applications which include preheat, rework, re-flow and curing of printed circuit board assemblies. The GF-DL-HT is capable of lead and lead free, high temperature applications and has dual programmable, digital temperature controllers for precise temperature regulation.
| Re-flow Ovens | |
|---|---|
| Heating Area | 2 13" x 6.5" (330 mm x 163 mm) |
| Power | 900W each plate |
| Temperature Range (standard model) | 37° to 315°C (100° to 600°F) |