Cost-effective mini-sized batch re-flow oven provides forced air convection heating technology with individual time and temperature controls to make profile set up quick and easy. The single zone GF-B-HT comes in a table-top configuration or with an optional stand.  It has a high temperature model capable of lead and lead-free soldering and 2 cooling stations making it the best re-flow oven for the money.
This unique PCB shuttle system enables a higher throughput than standard batch ovens. Both sides of the oven have a cooling station. While one board is being processed, another board can be cooled and off-loaded, then a third board can be loaded and shuttled into the chamber for re-flow.
| Re-flow Ovens | |
|---|---|
| Conveyor Extensions | Dual Board Shuttle | 
| Cooling Station(s) | 1 | 
| Cooling Zone Venting | N/A | 
| CyclonicsTM (forced air) | 1 | 
| Heat Tunnel Length | N/A | 
| Heating Zones | 1 | 
| Max Board Height | 1.250" (32 mm) | 
| Max Board Width | 12" x 12" (305 mm x 305 mm) | 
| Max Temperature | 315°C (600°F) | 
| Nitrogen Option | Yes | 
| Overall Dimensions | 38.13" x 28.13" x 14.5" (968 mm x 715 mm x 368 mm) | 
| PC Interface | No | 
| Venting | 4" (102 mm) flange with integral fan |