Re-flow oven with 4 heating zones and 18" (457 mm) wide conveyor for low to medium volume soldering production runs. The 1800HT solder re-flow oven utilizes our patented Horizontal Convection® heating technology for extremely uniform temperature profiling across the board for enhanced re-flow surface-mount process control. Units available with a maximum temperature of 400°C (752°F) and can be used for lead or lead-free solder applications.
The ProcessSentryTM microprocessor control is the brain of this re-flow oven. All parameters are set and displayed in real time. The ProcessSentryTM is sophisticated yet clear and straightforward. Programming is intuitive and operation is truly user-friendly. The system provides unrivaled accuracy and repeatability while assuring safety and reliability. Also, a PC interface is optionally available.
Re-flow Ovens | |
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Conveyor Extensions | Option |
Cooling Station(s) | 2 |
Cooling Zone Venting | 4 |
CyclonicsTM (forced air) | 8 |
Heat Tunnel Length | 50" (1250 mm) |
Heating Zones | 4 top, 4 bottom |
Max Board Height | 1.375" (35 mm) |
Max Board Width | 18" (457 mm) |
Max Temperature | 400°C (752°F) |
Nitrogen Option | Yes |
Overall Dimensions | 94" x 43" x 50" (2388 mm x 1092 mm x 1270 mm) |
PC Interface | Included |
Venting | 2 4" (102 mm) dia. flanges, 250 CFM (425 m3/h) each |