Re-flow oven with 4 heating zones and 18" (457 mm) wide conveyor for low to medium volume soldering production runs. The 1800HT solder re-flow oven utilizes our patented Horizontal Convection® heating technology for extremely uniform temperature profiling across the board for enhanced re-flow surface-mount process control. Units available with a maximum temperature of 400°C (752°F) and can be used for lead or lead-free solder applications.
The ProcessSentryTM microprocessor control is the brain of this re-flow oven. All parameters are set and displayed in real time. The ProcessSentryTM is sophisticated yet clear and straightforward. Programming is intuitive and operation is truly user-friendly. The system provides unrivaled accuracy and repeatability while assuring safety and reliability. Also, a PC interface is optionally available.
| Re-flow Ovens | |
|---|---|
| Conveyor Extensions | Option | 
| Cooling Station(s) | 2 | 
| Cooling Zone Venting | 4 | 
| CyclonicsTM (forced air) | 8 | 
| Heat Tunnel Length | 50" (1250 mm) | 
| Heating Zones | 4 top, 4 bottom | 
| Max Board Height | 1.375" (35 mm) | 
| Max Board Width | 18" (457 mm) | 
| Max Temperature | 400°C (752°F) | 
| Nitrogen Option | Yes | 
| Overall Dimensions | 94" x 43" x 50" (2388 mm x 1092 mm x 1270 mm) | 
| PC Interface | Included | 
| Venting | 2 4" (102 mm) dia. flanges, 250 CFM (425 m3/h) each |